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Sockets for ICs, Transistors (11554)

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Records 11554
Page 1107/1156

Part Number:

XR2C-2000-HSG

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC SOCKET 20POS

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    -

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    Housing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    -

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    -

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    20 (1 x 20)

  • Contact Material - Post:

    -

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8532

1

Part Number:

XR2C-2002

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 20POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Wire Wrap

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    20 (1 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6516

1

Part Number:

XR2C-2005

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 20POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    20 (1 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8640

1

Part Number:

XR2C-2011-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 20POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    20 (1 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5202

1

Part Number:

XR2C-2015

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 20POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    20 (1 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7668

1

Part Number:

XR2C2611N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 26POS GOLD

  • Series:

    Brass

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    -

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    26 (1 x 26)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

4374

1

Part Number:

XR2C-3200-HSG

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC SOCKET 32POS

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Wire Wrap

  • Pitch - Mating:

    -

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    Housing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    -

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    -

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (1 x 32)

  • Contact Material - Post:

    -

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8082

1

Part Number:

XR2C-3205

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 32POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (1 x 32)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7560

1

Part Number:

XR2C3215

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 32POS GOLD

  • Series:

    Brass

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    -

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (1 x 32)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8010

1

Part Number:

XR2D-2401-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 24POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Carrier

  • Features:

    29.5µin (0.75µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    29.5µin (0.75µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    24 (2 x 12)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5436

1

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