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Sockets for ICs, Transistors (11554)

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Records 11554
Page 1105/1156

Part Number:

XR2A-1801-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 18POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    18 (2 x 9)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

4608

1

Part Number:

XR2A-2001-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 20POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    20 (2 x 10)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5886

1

Part Number:

XR2A-2025

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 20POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    Flash

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    Flash

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    20 (2 x 10)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

2538

1

Part Number:

XR2A2201N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 22POS GOLD

  • Series:

    Brass

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.4" (10.16mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    29.5µin (0.75µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    29.5µin (0.75µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    22 (2 x 11)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7074

1

Part Number:

XR2A-2401-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 24POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    24 (2 x 12)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5418

1

Part Number:

XR2A-2411-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 24POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    24 (2 x 12)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7068

1

Part Number:

XR2A-2801-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 28POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    28 (2 x 14)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

2682

1

Part Number:

XR2A-2811-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 28POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    28 (2 x 14)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6138

1

Part Number:

XR2A-2815

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 28POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    28 (2 x 14)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

4770

1

Part Number:

XR2A-3201-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 32POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (2 x 16)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

2340

1

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