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Sockets for ICs, Transistors (11554)

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Records 11554
Page 1108/1156

Part Number:

XR2D-4001-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 40POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Carrier

  • Features:

    29.5µin (0.75µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    29.5µin (0.75µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    40 (2 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8568

1

Part Number:

XR2E-3201-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 32POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Carrier

  • Features:

    29.5µin (0.75µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    29.5µin (0.75µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (1 x 32)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

4032

1

Part Number:

XR2E-3204

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 32POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (1 x 32)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7092

1

Part Number:

XR2E-3205

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 32POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    -

  • Features:

    -

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    -

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (1 x 32)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7956

1

Part Number:

XR2H-1611-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN ZIG-ZAG 16POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    Zig-Zag

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    16 (2 x 8)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6858

1

Part Number:

XR2P1041

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 10POS GOLD

  • Series:

    Brass

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    -

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    10 (1 x 10)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7344

1

Part Number:

XR2P2041

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 20POS GOLD

  • Series:

    Brass

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    -

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    20 (1 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5076

1

Part Number:

XR2T-1621-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 16POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame, Seal Tape

  • Features:

    Flash

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    Flash

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    16 (2 x 8)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5832

1

Part Number:

XR2T-2021-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 20POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame, Seal Tape

  • Features:

    Flash

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    Flash

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    20 (2 x 10)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

3816

1

Part Number:

XR2T2401N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 24POS GOLD

  • Series:

    Brass

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.4" (10.16mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    29.5µin (0.75µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    29.5µin (0.75µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    24 (2 x 12)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

4878

1

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