Heisener Electronics
BOM

XR2C-2002

Wire Wrap
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

CONN SOCKET SIP 20POS GOLD

Specifications

Brand
Omron Electronics Inc-EMC Div
Package
—
Packaging
—
Weight
—

Total Inventory

6,516pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how XR2C-2002 from Omron Electronics Inc-EMC Div fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerThrough Hole
SeriesBeryllium Copper
Type-55°C ~ 125°C
Number of Positions or Pins (Grid)Wire Wrap
Pitch - MatingGold
Contact Finish - MatingOmron Electronics Inc-EMC Div
Contact Finish Thickness - MatingSIP
Contact Material - Mating0.100" (2.54mm)
Mounting TypeClosed Frame
Features30µin (0.76µm)
TerminationPolybutylene Terephthalate (PBT), Glass Filled
Pitch - Post30µin (0.76µm)
Contact Finish - PostXR2
Contact Finish Thickness - Post20 (1 x 20)
Contact Material - PostGold
Housing MaterialBeryllium Copper
Operating Temperature0.100" (2.54mm)

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