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XR2D-2401-N

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Part Number

XR2D-2401-N

Manufacturer

Omron Electronics Inc-EMC Div

Description

CONN IC DIP SOCKET 24POS GOLD

Lifecycle

Obsolete

RoHS

No RoHS Information

EDA/CAD Models

XR2D-2401-N PCB Footprint and Symbol

Warehouses

USA, Europe, China, Hong Kong SAR

Estimated Delivery

Sep 28 - Oct 3 (Choose Expedited Shipping)

Warranty

Up to 1 year [Limitety]*

1
In Stock:5436 pcs

运送服务：

XR2D-2401-N 规格

Contact Finish - Mating
Omron Electronics Inc-EMC Div
Contact Finish - Post
XR2
Contact Finish Thickness - Mating
DIP, 0.6" (15.24mm) Row Spacing
Contact Finish Thickness - Post
24 (2 x 12)
Contact Material - Mating
0.100" (2.54mm)
Contact Material - Post
Gold
Features
29.5µin (0.75µm)
Housing Material
Beryllium Copper
Manufacturer
Through Hole
Mounting Type
Carrier
Number of Positions or Pins (Grid)
Solder
Operating Temperature
0.100" (2.54mm)
Pitch - Mating
Gold
Pitch - Post
29.5µin (0.75µm)
Series
Beryllium Copper
Termination
Polybutylene Terephthalate (PBT), Glass Filled
Type
-55°C ~ 125°C

XR2D-2401-N 标签

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