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Sockets for ICs, Transistors (11554)

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Records 11554
Page 1106/1156

Part Number:

XR2A-3211-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 32POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (2 x 16)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

2430

1

Part Number:

XR2A-3211-NZ

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 32POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    25µin (0.63µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    25µin (0.63µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (2 x 16)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7722

1

Part Number:

XR2A3221N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 32POS GOLD

  • Series:

    Brass

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    32 (2 x 16)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5346

1

Part Number:

XR2A-4001-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 40POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    30µin (0.76µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    40 (2 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5706

1

Part Number:

XR2A-4011-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 40POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    40 (2 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

4590

1

Part Number:

XR2C-0311-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 3POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    3 (1 x 3)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6912

1

Part Number:

XR2C1011N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 10POS GOLD

  • Series:

    Brass

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    -

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    10 (1 x 10)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

3436

1

Part Number:

XR2C-1501-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 15POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    15 (1 x 15)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

2754

1

Part Number:

XR2C-1511-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 15POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    15 (1 x 15)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

2304

1

Part Number:

XR2C-1611-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN SOCKET SIP 16POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    16 (1 x 16)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7974

1

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