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Sockets for ICs, Transistors (11554)

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Records 11554
Page 1104/1156

Part Number:

WMS-480Z

Manufacturer:

On Shore Technology Inc.

Description:

CONN IC DIP SOCKET 48POS GOLD

  • Series:

    Brass

  • Type:

    -40°C ~ 105°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    On Shore Technology Inc.

  • Contact Finish Thickness - Mating:

    DIP, 0.6" (15.24mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame, Wash Away

  • Features:

    Flash

  • Termination:

    -

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    WMS

  • Contact Finish Thickness - Post:

    48 (2 x 24)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6084

1

Part Number:

XR2A-0802

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 8POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Wire Wrap

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    29.5µin (0.75µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    29.5µin (0.75µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    8 (2 x 4)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8910

1

Part Number:

XR2A-0811-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 8POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    8 (2 x 4)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6660

1

Part Number:

XR2A0815

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 8POS GOLD

  • Series:

    Brass

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    8 (2 x 4)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7704

1

Part Number:

XR2A-0825

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 8POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    Flash

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    Flash

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    8 (2 x 4)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5742

1

Part Number:

XR2A-1401-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 14POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    29.5µin (0.75µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    29.5µin (0.75µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    14 (2 x 7)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

14460

1

Part Number:

XR2A-1411-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 14POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    14 (2 x 7)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5274

1

Part Number:

XR2A-1425

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 14POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    Flash

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    Flash

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    14 (2 x 7)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7092

1

Part Number:

XR2A-1611-N

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 16POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    10µin (0.25µm)

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    16 (2 x 8)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

9108

1

Part Number:

XR2A-1625

Manufacturer:

Omron Electronics Inc-EMC Div

Description:

CONN IC DIP SOCKET 16POS GOLD

  • Series:

    Beryllium Copper

  • Type:

    -55°C ~ 125°C

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Gold

  • Contact Finish - Mating:

    Omron Electronics Inc-EMC Div

  • Contact Finish Thickness - Mating:

    DIP, 0.3" (7.62mm) Row Spacing

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Open Frame

  • Features:

    Flash

  • Termination:

    Polybutylene Terephthalate (PBT), Glass Filled

  • Pitch - Post:

    Flash

  • Contact Finish - Post:

    XR2

  • Contact Finish Thickness - Post:

    16 (2 x 8)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8424

1

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