Part Number:
AGFA023R24C3E3E
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 2340BGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
Part Number:
AGFA023R24C3E4X
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 2340BGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
Part Number:
1SX250HH2F55I1VG
Manufacturer:
Intel
Description:
IC FPGA STRATIX 10 2912FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 2500K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2912-BBGA, FCBGA
Supplier Device Package:
2912-FBGA, FC (55x55)
Stock:
0
Part Number:
1SX250HH2F55I2VG
Manufacturer:
Intel
Description:
IC FPGA STRATIX 10 2912FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 2500K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2912-BBGA, FCBGA
Supplier Device Package:
2912-FBGA, FC (55x55)
Stock:
0
Part Number:
AGFC023R31C2I2VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 3184BGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
Part Number:
1SX250HH2F55I2LG
Manufacturer:
Intel
Description:
IC FPGA STRATIX 10 2912FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 2500K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2912-BBGA, FCBGA
Supplier Device Package:
2912-FBGA, FC (55x55)
Stock:
0
Part Number:
AGFC023R31C2I1VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 3184BGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
Part Number:
AGID019R18A1E2VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-I 1805BGA
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 1.9M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1805-BBGA Exposed Pad
Supplier Device Package:
1805-BGA (42.5x42.5)
Stock:
0
Part Number:
AGFA023R24C2E2V
Manufacturer:
Intel
Description:
IC
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
Part Number:
AGFA023R24C2E3V
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 2340BGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
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