SoC (System On Chip) (4856)

Series:

KeyStone Multicore

Architecture:

DSP, MPU

Core Processor:

C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

-

Peripherals:

DDR, DMA, PCIe, POR, WDT

Connectivity:

Ethernet, I2C, SPI, UART/USART, USB

Speed:

1.2GHz

Primary Attributes:

-

Operating Temperature:

0°C ~ 100°C (TC)

Package / Case:

1517-BBGA, FCBGA

Supplier Device Package:

1517-FCBGA (40x40)

Series:

PolarFire®

Architecture:

MPU, FPGA

Core Processor:

RISC-V

Flash Size:

128kB

RAM Size:

3.95MB

Peripherals:

DMA, PCI, PWM

Connectivity:

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

Speed:

-

Primary Attributes:

FPGA - 461K Logic Modules

Operating Temperature:

0°C ~ 100°C

Package / Case:

1152-BBGA, FCBGA

Supplier Device Package:

1152-FCBGA (35x35)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 4.047M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

3948-BFBGA Exposed Pad

Supplier Device Package:

3948-BGA (56x56)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 4.047M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

3948-BFBGA Exposed Pad

Supplier Device Package:

3948-BGA (56x56)

Series:

Arria V SX

Architecture:

MCU, FPGA

Core Processor:

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

64KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

800MHz

Primary Attributes:

FPGA - 350K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

1152-BBGA, FCBGA

Supplier Device Package:

1152-FBGA, FC (35x35)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 4.047M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

3948-BFBGA Exposed Pad

Supplier Device Package:

3948-BGA (56x56)

Series:

-

Architecture:

DSP, MPU

Core Processor:

Dual ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x

Flash Size:

-

RAM Size:

2.5MB

Peripherals:

DMA, PWM, WDT

Connectivity:

CANbus, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB

Speed:

1.176GHz, 750MHz

Primary Attributes:

-

Operating Temperature:

-40°C ~ 125°C (TJ)

Package / Case:

760-LFBGA, FCBGA

Supplier Device Package:

760-FCBGA (23x23)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 4.047M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

3948-BFBGA Exposed Pad

Supplier Device Package:

3948-BGA (56x56)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 4.047M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

3948-BFBGA Exposed Pad

Supplier Device Package:

3948-BGA (56x56)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 4.047M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

3948-BFBGA Exposed Pad

Supplier Device Package:

3948-BGA (56x56)