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SoC (System On Chip) (4856)

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Part Number:

MPFS250T-1FCVG484E

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 484FCBGA

  • Series:

    PolarFire®

  • Architecture:

    MPU, FPGA

  • Core Processor:

    RISC-V

  • Flash Size:

    128kB

  • RAM Size:

    2.2MB

  • Peripherals:

    DMA, PCI, PWM

  • Connectivity:

    CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

  • Speed:

    -

  • Primary Attributes:

    FPGA - 254K Logic Modules

  • Operating Temperature:

    0°C ~ 100°C

  • Package / Case:

    484-BFBGA, FCBGA

  • Supplier Device Package:

    484-FCBGA (19x19)

Stock:

252

1

Part Number:

MPFS250T-1FCVG484I

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 484FCBGA

  • Series:

    PolarFire®

  • Architecture:

    MPU, FPGA

  • Core Processor:

    RISC-V

  • Flash Size:

    128kB

  • RAM Size:

    2.2MB

  • Peripherals:

    DMA, PCI, PWM

  • Connectivity:

    CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

  • Speed:

    -

  • Primary Attributes:

    FPGA - 254K Logic Modules

  • Operating Temperature:

    -40°C ~ 100°C

  • Package / Case:

    484-BFBGA, FCBGA

  • Supplier Device Package:

    484-FCBGA (19x19)

Stock:

543

1

Part Number:

AGFA023R24C2I2V

Manufacturer:

Intel

Description:

IC

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGFA023R24C2I3V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGFA023R24C2I3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGFA023R24C2I1V

Manufacturer:

Intel

Description:

IC

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

TCI6636K2HDAAWA24T

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    KeyStone Multicore

  • Architecture:

    DSP, MPU

  • Core Processor:

    C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    DDR, DMA, PCIe, POR, WDT

  • Connectivity:

    Ethernet, I2C, SPI, UART/USART, USB

  • Speed:

    1.2GHz, 1.4GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 100°C (TC)

  • Package / Case:

    1517-BBGA, FCBGA

  • Supplier Device Package:

    1517-FCBGA (40x40)

Stock:

0

1

Part Number:

AGFB012R24C2I2VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.2M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGFB012R24C2I1VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.2M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGID019R18A2E2V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 1805FBGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

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