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SoC (System On Chip) (4856)

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Part Number:

AGFA023R24C2E3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGFA023R24C2E4X

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGFA023R24C2E1V

Manufacturer:

Intel

Description:

IC

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGID019R18A1E1VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 1805BGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1805-BBGA Exposed Pad

  • Supplier Device Package:

    1805-BGA (42.5x42.5)

Stock:

0

1

Part Number:

MIMX8ML8DVNLZDB

Manufacturer:

NXP

Description:

IC

  • Series:

    i.MX8ML

  • Architecture:

    DSP, MCU, MPU

  • Core Processor:

    ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP

  • Flash Size:

    -

  • RAM Size:

    868KB

  • Peripherals:

    DMA, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART

  • Speed:

    1.8GHz, 800MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    0°C ~ 95°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

MIMX8ML8DVNLZCB

Manufacturer:

NXP

Description:

IC

  • Series:

    i.MX8ML

  • Architecture:

    DSP, MCU, MPU

  • Core Processor:

    ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP

  • Flash Size:

    -

  • RAM Size:

    868KB

  • Peripherals:

    DMA, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART

  • Speed:

    1.8GHz, 800MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    0°C ~ 95°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGID019R18A2I2V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 1805FBGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1805-BBGA Exposed Pad

  • Supplier Device Package:

    1805-BGA (42.5x42.5)

Stock:

0

1

Part Number:

AGID019R18A2I3V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 1805FBGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1805-BBGA Exposed Pad

  • Supplier Device Package:

    1805-BGA (42.5x42.5)

Stock:

0

1

Part Number:

AGID019R18A2I3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 1805FBGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1805-BBGA Exposed Pad

  • Supplier Device Package:

    1805-BGA (42.5x42.5)

Stock:

0

1

Part Number:

AGID019R18A2I1V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 1805FBGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1805-BBGA Exposed Pad

  • Supplier Device Package:

    1805-BGA (42.5x42.5)

Stock:

0

1

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