Part Number:
TCI6636K2HDXAAW2
Manufacturer:
Texas Instruments
Description:
PROTOTYPE
Series:
KeyStone Multicore
Architecture:
DSP, MPU
Core Processor:
C66x, Quad ARM® Cortex®-A15 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
-
Peripherals:
DDR, DMA, PCIe, POR, WDT
Connectivity:
Ethernet, I2C, SPI, UART/USART, USB
Speed:
1.2GHz
Primary Attributes:
-
Operating Temperature:
0°C ~ 100°C (TC)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40x40)
Stock:
0
Part Number:
AGID023R18A2E2VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-I 1805BGA
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1805-BBGA Exposed Pad
Supplier Device Package:
1805-BGA (42.5x42.5)
Stock:
0
Part Number:
AGFB023R31C3I3E
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 3184FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
Part Number:
1SX280LN3F43E2VGS2
Manufacturer:
Intel
Description:
IC FPGA STRATIX 10 1760FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 2800K Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FBGA (42.5x42.5)
Stock:
0
Part Number:
AGFB006R24D2I2V
Manufacturer:
Intel
Description:
IC
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 573K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
Part Number:
AGFB006R24D2I3V
Manufacturer:
Intel
Description:
IC
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 573K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
Part Number:
1SX280LN3F43E2VGAS
Manufacturer:
Intel
Description:
IC FPGA STRATIX 10 1760FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 2800K Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FBGA (42.5x42.5)
Stock:
0
Part Number:
AGFB014R24D1E3V
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 2340FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 1.4M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
Part Number:
1SX065HH2F35I1VG
Manufacturer:
Intel
Description:
IC FPGA STRATIX10SX 1152FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 650K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35x35)
Stock:
0
Part Number:
AGFB014R24D1E2V
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 2340FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 1.4M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
每日获取来自全球众多供应商的最新优惠资讯