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SoC (System On Chip) (4856)

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Part Number:

MPFS160T-FCVG484I

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 484FCBGA

  • Series:

    PolarFire®

  • Architecture:

    MPU, FPGA

  • Core Processor:

    RISC-V

  • Flash Size:

    128kB

  • RAM Size:

    1.4125MB

  • Peripherals:

    DMA, PCI, PWM

  • Connectivity:

    CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

  • Speed:

    -

  • Primary Attributes:

    FPGA - 161K Logic Modules

  • Operating Temperature:

    -40°C ~ 100°C

  • Package / Case:

    484-BFBGA, FCBGA

  • Supplier Device Package:

    484-FCBGA (19x19)

Stock:

9

1

Part Number:

MPFS160T-FCVG484E

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 484FCBGA

  • Series:

    PolarFire®

  • Architecture:

    MPU, FPGA

  • Core Processor:

    RISC-V

  • Flash Size:

    128kB

  • RAM Size:

    1.4125MB

  • Peripherals:

    DMA, PCI, PWM

  • Connectivity:

    CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

  • Speed:

    -

  • Primary Attributes:

    FPGA - 161K Logic Modules

  • Operating Temperature:

    0°C ~ 100°C

  • Package / Case:

    484-BFBGA, FCBGA

  • Supplier Device Package:

    484-FCBGA (19x19)

Stock:

9

1

Part Number:

AGFB006R24D1I2V

Manufacturer:

Intel

Description:

IC

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 573K Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGID023R18A2E1VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 1805BGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1805-BBGA Exposed Pad

  • Supplier Device Package:

    1805-BGA (42.5x42.5)

Stock:

0

1

Part Number:

MPFS160TS-FCVG484I

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 484FCBGA

  • Series:

    PolarFire®

  • Architecture:

    MPU, FPGA

  • Core Processor:

    RISC-V

  • Flash Size:

    128kB

  • RAM Size:

    1.4125MB

  • Peripherals:

    DMA, PCI, PWM

  • Connectivity:

    CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

  • Speed:

    -

  • Primary Attributes:

    FPGA - 161K Logic Modules

  • Operating Temperature:

    -40°C ~ 100°C

  • Package / Case:

    484-BFBGA, FCBGA

  • Supplier Device Package:

    484-FCBGA (19x19)

Stock:

9

1

Part Number:

AGIB041R31B1I2VR0

Manufacturer:

Intel

Description:

IC

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 4M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

Part Number:

BCM33843MRKFSBGB0T

Manufacturer:

Broadcom

Description:

CABLE MODEM

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    2.4GHz, 5GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGIB019R18A1E1VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 1805BGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1805-BBGA Exposed Pad

  • Supplier Device Package:

    1805-BGA (42.5x42.5)

Stock:

0

1

Part Number:

TDA1MSVCCYEQ5RQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

BCM47452B0KRFBG

Manufacturer:

Broadcom

Description:

2X2 802.11AC + ARM SOC

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

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