Heisener Electronics
BOM

AGID023R18A2E2VB

OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount

IC FPGA AGILEX-I 1805BGA

Specifications

Brand
Intel
Package
1805-BBGA Exposed Pad
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how AGID023R18A2E2VB from Intel fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerIntel
SeriesAgilex I
ArchitectureMPU, FPGA
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size-
RAM Size256KB
PeripheralsDMA, WDT
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed1.4GHz
Primary AttributesFPGA - 2.3M Logic Elements
Operating Temperature0°C ~ 100°C (TJ)
Package / Case1805-BBGA Exposed Pad
Supplier Device Package1805-BGA (42.5x42.5)

Recommended Products

CRGV2010F64K9

CRGV2010F64K9

RES SMD 64.9K OHM 1% 1/2W 2010

PL8133

PL8133

IDCTR T44-52 487.3UH .95AD PBC

552AC000059DG

552AC000059DG

XTAL OSC VCXO 3.3V 6SMD

SIT8208AI-22-18S-74-250000X

SIT8208AI-22-18S-74-250000X

MEMS OSC XO 74.2500MHZ LVCMOS LV

SIT8208AI-22-25E-6-000000Y

SIT8208AI-22-25E-6-000000Y

MEMS OSC XO 6.0000MHZ LVCM LVTTL

EL1517AIYE_222

EL1517AIYE_222

IC DRIVER 1/0 10HMSOP

021901-6M

021901-6M

FUSE GLASS 1.6A 250VAC 5X20MM

RJSNEG38L08

RJSNEG38L08

CONN MOD JACK 8P8C R/A SHLD

M83723-74R22557_64

M83723-74R22557_64

CONN RCPT 55POS JAM NUT W/PINS

PAG-M0-6NL-AC52NZ

PAG-M0-6NL-AC52NZ

CONN INLINE PLUG 6PIN SLD CUP