Part Number:
1SX065HH2F35I2LG
Manufacturer:
Intel
Description:
IC FPGA STRATIX10SX 1152FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 650K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35x35)
Stock:
0
Part Number:
AGIB019R18A1E2VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-I 1805BGA
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 1.9M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1805-BBGA Exposed Pad
Supplier Device Package:
1805-BGA (42.5x42.5)
Stock:
0
Part Number:
AGFB023R31C3E3V
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 3184FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
Part Number:
AGFB023R31C3E3E
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 3184FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
Part Number:
AGFB023R31C3E4X
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 3184FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
Part Number:
1SX065HH2F35I2VG
Manufacturer:
Intel
Description:
IC FPGA STRATIX10SX 1152FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 650K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA (35x35)
Stock:
0
Part Number:
AGFB006R24D2E2V
Manufacturer:
Intel
Description:
IC
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 573K Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
Part Number:
AGFB006R24D2E3V
Manufacturer:
Intel
Description:
IC
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 573K Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2340-BFBGA Exposed Pad
Supplier Device Package:
2340-BGA (45x42)
Stock:
0
Part Number:
MPFS160TL-FCSG536E
Manufacturer:
Microchip Technology
Description:
IC SOC RISC-V 536LFBGA
Series:
PolarFire®
Architecture:
MPU, FPGA
Core Processor:
RISC-V
Flash Size:
128kB
RAM Size:
1.4125MB
Peripherals:
DMA, PCI, PWM
Connectivity:
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed:
-
Primary Attributes:
FPGA - 161K Logic Modules
Operating Temperature:
0°C ~ 100°C
Package / Case:
536-LFBGA, CSPBGA
Supplier Device Package:
536-LFBGA
Stock:
0
Part Number:
MPFS160TL-FCSG536I
Manufacturer:
Microchip Technology
Description:
IC SOC RISC-V 536LFBGA
Series:
PolarFire®
Architecture:
MPU, FPGA
Core Processor:
RISC-V
Flash Size:
128kB
RAM Size:
1.4125MB
Peripherals:
DMA, PCI, PWM
Connectivity:
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed:
-
Primary Attributes:
FPGA - 161K Logic Modules
Operating Temperature:
-40°C ~ 100°C
Package / Case:
536-LFBGA, CSPBGA
Supplier Device Package:
536-LFBGA
Stock:
0
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