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Wire Wrap
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CONN IC DIP SOCKET 8POS GOLD
Specifications
- Brand
- Omron Electronics Inc-EMC Div
- Package
- —
- Packaging
- —
- Weight
- —
Total Inventory
8,910pcs
Ship within 8 hours
MOQ: 1 pcs
Certifications & Authorizations
Product Video
Discover how XR2A-0802 from Omron Electronics Inc-EMC Div fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.
- Authentic sourcing with full traceability
- Rigorous incoming quality inspection
- Competitive pricing & global fast delivery
- Dedicated application engineering support
Technical Specifications
| Manufacturer | Through Hole | |
| Series | Beryllium Copper | |
| Type | -55°C ~ 125°C | |
| Number of Positions or Pins (Grid) | Wire Wrap | |
| Pitch - Mating | Gold | |
| Contact Finish - Mating | Omron Electronics Inc-EMC Div | |
| Contact Finish Thickness - Mating | DIP, 0.3" (7.62mm) Row Spacing | |
| Contact Material - Mating | 0.100" (2.54mm) | |
| Mounting Type | Open Frame | |
| Features | 29.5µin (0.75µm) | |
| Termination | Polybutylene Terephthalate (PBT), Glass Filled | |
| Pitch - Post | 29.5µin (0.75µm) | |
| Contact Finish - Post | XR2 | |
| Contact Finish Thickness - Post | 8 (2 x 4) | |
| Contact Material - Post | Gold | |
| Housing Material | Beryllium Copper | |
| Operating Temperature | 0.100" (2.54mm) |
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