Logo

SoC (System On Chip) (4856)

Records 0
Reset All
Records 4856
Page 446/486

Part Number:

AGID019R31B2I2VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 3184BGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

Part Number:

AGID019R31B2I1VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-I 3184BGA

  • Series:

    Agilex I

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

Part Number:

7271APKFSBB3-B0T

Manufacturer:

Broadcom

Description:

BCM7271 UHD STB CLIENT

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

1SX280HH2F55E2VGS3

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2912FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 2800K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2912-BBGA, FCBGA

  • Supplier Device Package:

    2912-FBGA, FC (55x55)

Stock:

0

1

Part Number:

AGFA006R24C3I3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 573K Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

TDA3LRABABFQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 250MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1

Part Number:

AGFB027R25A1E1V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2581FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.7M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGFA022R24C2I1V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.2M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGFA022R24C2I2V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.2M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGFA022R24C2I3V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.2M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

获取最新资讯

每日获取来自全球众多供应商的最新优惠资讯