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TDA3LRABABFQ1

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PROTOTYPE

Specifications

Brand
Texas Instruments
Package
367-BFBGA, FCBGA
Packaging
—
Weight
—

Total Inventory

0pcs

Ship within 8 hours

MOQ: 1 pcs

Certifications & Authorizations

Product Video

Discover how TDA3LRABABFQ1 from Texas Instruments fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.

  • Authentic sourcing with full traceability
  • Rigorous incoming quality inspection
  • Competitive pricing & global fast delivery
  • Dedicated application engineering support

Technical Specifications

ManufacturerTexas Instruments
Series-
ArchitectureDSP, MPU
Core ProcessorARM® Cortex®-M4, C66x
Flash Size-
RAM Size512kB
PeripheralsDMA, POR, PWM, WDT
ConnectivityCANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB
Speed212.8MHz, 250MHz
Primary Attributes-
Operating Temperature-40°C ~ 125°C (TJ)
Package / Case367-BFBGA, FCBGA
Supplier Device Package367-FCBGA (15x15)

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