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Part Number:

AGFA022R24C2I3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.2M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGFA014R24C3E4X

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.4M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGFA014R24C3E3V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.4M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGFA014R24C3E3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.4M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

1SX165HU3F50I2VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2397FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 1650K Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2397-BBGA, FCBGA

  • Supplier Device Package:

    2397-FBGA, FC (50x50)

Stock:

0

1

Part Number:

1SX165HU3F50I3VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2397FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 1650K Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2397-BBGA, FCBGA

  • Supplier Device Package:

    2397-FBGA, FC (50x50)

Stock:

0

1

Part Number:

TDA1MEVAAASQ4RQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

BCM3384GUKFSBGB0T

Manufacturer:

Broadcom

Description:

CABLE MODEM

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGFB019R25A2E2V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2581FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGFB019R25A2E4X

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2581FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

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