Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
XCZU5EV-3SFVC784E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EV
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
441
Part Number:
XCZU5EV-L1FBVB900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EV
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
497
Part Number:
XCZU5EV-L1SFVC784I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EV
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
280
Part Number:
XCZU5EV-L2FBVB900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EV
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
180
Part Number:
XCZU5EV-L2SFVC784E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EV
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
181
Part Number:
XCZU6CG-1FFVB1156E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC CG
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
187
Part Number:
XCZU6CG-1FFVB1156I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC CG
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
142
Part Number:
XCZU6CG-1FFVC900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC CG
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
487
Part Number:
XCZU6CG-1FFVC900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC CG
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
498
Part Number:
XCZU6CG-2FFVB1156E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1156FCBGA
Series:
Zynq® UltraScale+™ MPSoC CG
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1156-BBGA, FCBGA
Supplier Device Package:
1156-FCBGA (35x35)
Stock:
274
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