Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
XCZU5EG-1SFVC784I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
421
Part Number:
XCZU5EG-2FBVB900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
251
Part Number:
XCZU5EG-2FBVB900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
436
Part Number:
XCZU5EG-2SFVC784E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
400
Part Number:
XCZU5EG-2SFVC784I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
494
Part Number:
XCZU5EG-3FBVB900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
255
Part Number:
XCZU5EG-3SFVC784E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
231
Part Number:
XCZU5EG-L1FBVB900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
317
Part Number:
XCZU5EG-L1SFVC784I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 784FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
784-BFBGA, FCBGA
Supplier Device Package:
784-FCBGA (23x23)
Stock:
172
Part Number:
XCZU5EG-L2FBVB900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 900FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
365
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