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Embedded Processors & Controllers (139284)

Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.

Records 139284
Page 13918/13929

Part Number:

XCZU6CG-2FFVB1156I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1156FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC CG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1156-BBGA, FCBGA

  • Supplier Device Package:

    1156-FCBGA (35x35)

Stock:

477

1

Part Number:

XCZU6CG-2FFVC900E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 900FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC CG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

438

1

Part Number:

XCZU6CG-2FFVC900I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 900FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC CG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

276

1

Part Number:

XCZU6CG-L1FFVB1156I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1156FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC CG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    500MHz, 1.2GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1156-BBGA, FCBGA

  • Supplier Device Package:

    1156-FCBGA (35x35)

Stock:

252

1

Part Number:

XCZU6CG-L1FFVC900I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 900FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC CG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    500MHz, 1.2GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

222

1

Part Number:

XCZU6CG-L2FFVB1156E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1156FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC CG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1156-BBGA, FCBGA

  • Supplier Device Package:

    1156-FCBGA (35x35)

Stock:

255

1

Part Number:

XCZU6CG-L2FFVC900E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 900FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC CG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

111

1

Part Number:

XCZU6EG-1FFVB1156E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1156FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    500MHz, 600MHz, 1.2GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1156-BBGA, FCBGA

  • Supplier Device Package:

    1156-FCBGA (35x35)

Stock:

471

1

Part Number:

XCZU6EG-1FFVB1156I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1156FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    500MHz, 600MHz, 1.2GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1156-BBGA, FCBGA

  • Supplier Device Package:

    1156-FCBGA (35x35)

Stock:

341

1

Part Number:

XCZU6EG-1FFVC900E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 900FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    500MHz, 600MHz, 1.2GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

119

1

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