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Embedded Processors & Controllers (139284)

Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.

Records 139284
Page 13900/13929

Part Number:

XCZU19EG-2FFVB1517I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1517FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 600MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1517-BBGA, FCBGA

  • Supplier Device Package:

    1517-FCBGA (40x40)

Stock:

288

1

Part Number:

XCZU19EG-2FFVC1760E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1760FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 600MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1760-BBGA, FCBGA

  • Supplier Device Package:

    1760-FCBGA (42.5x42.5)

Stock:

129

1

Part Number:

XCZU19EG-2FFVC1760I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1760FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 600MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1760-BBGA, FCBGA

  • Supplier Device Package:

    1760-FCBGA (42.5x42.5)

Stock:

193

1

Part Number:

XCZU19EG-2FFVD1760E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1760FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 600MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1760-BBGA, FCBGA

  • Supplier Device Package:

    1760-FCBGA (42.5x42.5)

Stock:

452

1

Part Number:

XCZU19EG-2FFVD1760I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1760FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 600MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1760-BBGA, FCBGA

  • Supplier Device Package:

    1760-FCBGA (42.5x42.5)

Stock:

382

1

Part Number:

XCZU19EG-2FFVE1924E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1924FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 600MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1924-BBGA, FCBGA

  • Supplier Device Package:

    1924-FCBGA (45x45)

Stock:

396

1

Part Number:

XCZU19EG-2FFVE1924I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1924FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    533MHz, 600MHz, 1.3GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1924-BBGA, FCBGA

  • Supplier Device Package:

    1924-FCBGA (45x45)

Stock:

365

1

Part Number:

XCZU19EG-3FFVB1517E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1517FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    600MHz, 667MHz, 1.5GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1517-BBGA, FCBGA

  • Supplier Device Package:

    1517-FCBGA (40x40)

Stock:

379

1

Part Number:

XCZU19EG-3FFVC1760E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1760FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    600MHz, 667MHz, 1.5GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1760-BBGA, FCBGA

  • Supplier Device Package:

    1760-FCBGA (42.5x42.5)

Stock:

365

1

Part Number:

XCZU19EG-3FFVD1760E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A53 1760FCBGA

  • Series:

    Zynq® UltraScale+™ MPSoC EG

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    600MHz, 667MHz, 1.5GHz

  • Primary Attributes:

    Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1760-BBGA, FCBGA

  • Supplier Device Package:

    1760-FCBGA (42.5x42.5)

Stock:

408

1

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