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IC SOC CORTEX-A53 1760FCBGA
Specifications
- Brand
- Xilinx
- Package
- 1760-BBGA, FCBGA
- Packaging
- —
- Weight
- —
Total Inventory
365pcs
Ship within 8 hours
MOQ: 1 pcs
Certifications & Authorizations
Product Video
Discover how XCZU19EG-3FFVC1760E from Xilinx fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.
- Authentic sourcing with full traceability
- Rigorous incoming quality inspection
- Competitive pricing & global fast delivery
- Dedicated application engineering support
Technical Specifications
| Manufacturer | Xilinx Inc. | |
| Series | Zynq® UltraScale+™ MPSoC EG | |
| Architecture | MCU, FPGA | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
| Flash Size | - | |
| RAM Size | 256KB | |
| Peripherals | DMA, WDT | |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Speed | 600MHz, 667MHz, 1.5GHz | |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | |
| Operating Temperature | 0°C ~ 100°C (TJ) | |
| Package / Case | 1760-BBGA, FCBGA | |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
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Datasheet & Documents
xczu19eg-3ffvd1760e.pdf
PDF Document · 102 pages
