Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
XCZU19EG-3FFVE1924E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1924FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
600MHz, 667MHz, 1.5GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1924-BBGA, FCBGA
Supplier Device Package:
1924-FCBGA (45x45)
Stock:
167
Part Number:
XCZU19EG-L1FFVB1517I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1517FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40x40)
Stock:
320
Part Number:
XCZU19EG-L1FFVC1760I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1760FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5x42.5)
Stock:
401
Part Number:
XCZU19EG-L1FFVD1760I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1760FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5x42.5)
Stock:
358
Part Number:
XCZU19EG-L1FFVE1924I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1924FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 600MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1924-BBGA, FCBGA
Supplier Device Package:
1924-FCBGA (45x45)
Stock:
319
Part Number:
XCZU19EG-L2FFVB1517E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1517FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1517-BBGA, FCBGA
Supplier Device Package:
1517-FCBGA (40x40)
Stock:
165
Part Number:
XCZU19EG-L2FFVC1760E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1760FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5x42.5)
Stock:
488
Part Number:
XCZU19EG-L2FFVD1760E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1760FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FCBGA (42.5x42.5)
Stock:
282
Part Number:
XCZU19EG-L2FFVE1924E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 1924FCBGA
Series:
Zynq® UltraScale+™ MPSoC EG
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
533MHz, 600MHz, 1.3GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1924-BBGA, FCBGA
Supplier Device Package:
1924-FCBGA (45x45)
Stock:
141
Part Number:
XCZU2CG-1SBVA484E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A53 484FCBGA
Series:
Zynq® UltraScale+™ MPSoC CG
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
500MHz, 1.2GHz
Primary Attributes:
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19x19)
Stock:
109
每日获取来自全球众多供应商的最新优惠资讯