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Embedded Processors & Controllers (139284)

Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.

Records 139284
Page 13891/13929
XC7Z045-L2FBG676I

Part Number:

XC7Z045-L2FBG676I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 350K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    676-BBGA, FCBGA

  • Supplier Device Package:

    676-FCBGA (27x27)

Stock:

196

1
XC7Z045-L2FFG676I

Part Number:

XC7Z045-L2FFG676I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 350K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    676-BBGA, FCBGA

  • Supplier Device Package:

    676-FCBGA (27x27)

Stock:

198

1
XC7Z045-L2FFG900I

Part Number:

XC7Z045-L2FFG900I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 350K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

288

1
XC7Z100-1FF900I

Part Number:

XC7Z100-1FF900I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 667MHZ 900FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    667MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 444K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

216

1
XC7Z100-1FFG1156I

Part Number:

XC7Z100-1FFG1156I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 667MHZ 1156BGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    667MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 444K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1156-BBGA, FCBGA

  • Supplier Device Package:

    1156-FCBGA (35x35)

Stock:

280

1
XC7Z100-1FFG900I

Part Number:

XC7Z100-1FFG900I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 667MHZ 900FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    667MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 444K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

398

1
XC7Z100-2FF900I

Part Number:

XC7Z100-2FF900I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 444K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

301

1
XC7Z100-2FFG1156I

Part Number:

XC7Z100-2FFG1156I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 1156BGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 444K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1156-BBGA, FCBGA

  • Supplier Device Package:

    1156-FCBGA (35x35)

Stock:

480

1
XC7Z100-2FFG900I

Part Number:

XC7Z100-2FFG900I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 900FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 444K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    900-BBGA, FCBGA

  • Supplier Device Package:

    900-FCBGA (31x31)

Stock:

417

1
XC7Z100-L2FFG1156I

Part Number:

XC7Z100-L2FFG1156I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 1156BGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 444K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    1156-BBGA, FCBGA

  • Supplier Device Package:

    1156-FCBGA (35x35)

Stock:

420

1

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