Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
XC7Z045-1FFG676I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
313
Part Number:
XC7Z045-1FFG900C
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 900FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
334
Part Number:
XC7Z045-1FFG900CES
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 900FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
276
Part Number:
XC7Z045-1FFG900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 900FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
129
Part Number:
XC7Z045-2FBG676CES
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
242
Part Number:
XC7Z045-2FBG676E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
276
Part Number:
XC7Z045-2FBG676I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
328
Part Number:
XC7Z045-2FF676E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 KINTEX7 676BGA
Series:
Zynq?-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex?-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
3328
Part Number:
XC7Z045-2FF676I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
138
Part Number:
XC7Z045-2FF900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 900FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
255
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