Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
XC7Z045-2FF900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 900FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
321
Part Number:
XC7Z045-2FFG676E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
356
Part Number:
XC7Z045-2FFG676I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
315
Part Number:
XC7Z045-2FFG900CES
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 900FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
230
Part Number:
XC7Z045-2FFG900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 900FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
397
Part Number:
XC7Z045-2FFG900I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 900FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
517
Part Number:
XC7Z045-3FBG676E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 1GHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1GHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
133
Part Number:
XC7Z045-3FFG676E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 1GHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1GHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
364
Part Number:
XC7Z045-3FFG900E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 1GHZ 900FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1GHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
900-BBGA, FCBGA
Supplier Device Package:
900-FCBGA (31x31)
Stock:
490
Part Number:
XC7Z045-3FFV676E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 1GHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1GHz
Primary Attributes:
Kintex™-7 FPGA, 350K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
159
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