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Embedded Processors & Controllers (139284)

Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.

Records 139284
Page 13871/13929
TDA3LADBJABFRQ1

Part Number:

TDA3LADBJABFRQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 500MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1
TDA3LADBJFABFQ1

Part Number:

TDA3LADBJFABFQ1

Manufacturer:

Texas Instruments

Description:

LOW POWER SOC W/ VISION ACCELERA

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 500MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1
TDA3LADBJFABFRQ1

Part Number:

TDA3LADBJFABFRQ1

Manufacturer:

Texas Instruments

Description:

LOW POWER SOC W/ VISION ACCELERA

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 500MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1
TDA3LRABABFQ1

Part Number:

TDA3LRABABFQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 250MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1
TDA3LRABABFRQ1

Part Number:

TDA3LRABABFRQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1
TDA3LXBBABFQ1

Part Number:

TDA3LXBBABFQ1

Manufacturer:

Texas Instruments

Description:

LOW POWER SOC W/ PROCESSING, IMA

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 355MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1
TDA3LXBBABFRQ1

Part Number:

TDA3LXBBABFRQ1

Manufacturer:

Texas Instruments

Description:

LOW POWER SOC W/ PROCESSING, IMA

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 355MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1
TDA3LXRBFABFQ1

Part Number:

TDA3LXRBFABFQ1

Manufacturer:

Texas Instruments

Description:

LOW POWER SOC W/ PROCESSING, IMA

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 745MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1
TDA3LXRBFABFRQ1

Part Number:

TDA3LXRBFABFRQ1

Manufacturer:

Texas Instruments

Description:

LOW POWER SOC W/ PROCESSING, IMA

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 745MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1
TDA3MADBABFQ1

Part Number:

TDA3MADBABFQ1

Manufacturer:

Texas Instruments

Description:

LOW POWER SOC W/ FULL-FEATURED P

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    512kB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    212.8MHz, 500MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    367-BFBGA, FCBGA

  • Supplier Device Package:

    367-FCBGA (15x15)

Stock:

0

1

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