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LOW POWER SOC W/ PROCESSING, IMA
Specifications
- Brand
- Texas Instruments
- Package
- 367-BFBGA, FCBGA
- Packaging
- —
- Weight
- —
Total Inventory
0pcs
Ship within 8 hours
MOQ: 1 pcs
Certifications & Authorizations
Product Video
Discover how TDA3LXBBABFQ1 from Texas Instruments fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.
- Authentic sourcing with full traceability
- Rigorous incoming quality inspection
- Competitive pricing & global fast delivery
- Dedicated application engineering support
Technical Specifications
| Manufacturer | Texas Instruments | |
| Series | - | |
| Architecture | DSP, MPU | |
| Core Processor | ARM® Cortex®-M4, C66x | |
| Flash Size | - | |
| RAM Size | 512kB | |
| Peripherals | DMA, POR, PWM, WDT | |
| Connectivity | CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB | |
| Speed | 212.8MHz, 355MHz | |
| Primary Attributes | - | |
| Operating Temperature | -40°C ~ 125°C (TJ) | |
| Package / Case | 367-BFBGA, FCBGA | |
| Supplier Device Package | 367-FCBGA (15x15) |
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