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SoC (System On Chip) (4856)

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Part Number:

AGFA019R24C2E1VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

1SX040HH2F35E1VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX10SX 1152FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 400K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1152-BBGA, FCBGA

  • Supplier Device Package:

    1152-FBGA (35x35)

Stock:

0

1

Part Number:

1SX040HH2F35E2LG

Manufacturer:

Intel

Description:

IC FPGA STRATIX10SX 1152FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 400K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1152-BBGA, FCBGA

  • Supplier Device Package:

    1152-FBGA (35x35)

Stock:

0

1

Part Number:

1SX040HH2F35E2VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX10SX 1152FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 400K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1152-BBGA, FCBGA

  • Supplier Device Package:

    1152-FBGA (35x35)

Stock:

0

1

Part Number:

MPFS025T-FCSG325T2

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 325BGA

  • Series:

    PolarFire®

  • Architecture:

    MPU, FPGA

  • Core Processor:

    RISC-V

  • Flash Size:

    128KB

  • RAM Size:

    230.4KB

  • Peripherals:

    DMA, PCI, PWM

  • Connectivity:

    CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

  • Speed:

    -

  • Primary Attributes:

    FPGA - 23K Logic Modules

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    325-TFBGA

  • Supplier Device Package:

    325-BGA (11x11)

Stock:

0

1

Part Number:

AGFB023R31C2I2VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 3184BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

Part Number:

MPFS095TL-FCSG325I

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 325LFBGA

  • Series:

    PolarFire®

  • Architecture:

    MPU, FPGA

  • Core Processor:

    RISC-V

  • Flash Size:

    128KB

  • RAM Size:

    857.6kB

  • Peripherals:

    DMA, PCI, PWM

  • Connectivity:

    CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

  • Speed:

    -

  • Primary Attributes:

    FPGA - 93K Logic Modules

  • Operating Temperature:

    -40°C ~ 100°C

  • Package / Case:

    325-LFBGA

  • Supplier Device Package:

    325-LFBGA (11x14.5)

Stock:

9

1

Part Number:

MPFS095TL-FCSG325E

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 325LFBGA

  • Series:

    PolarFire®

  • Architecture:

    MPU, FPGA

  • Core Processor:

    RISC-V

  • Flash Size:

    128KB

  • RAM Size:

    857.6kB

  • Peripherals:

    DMA, PCI, PWM

  • Connectivity:

    CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

  • Speed:

    -

  • Primary Attributes:

    FPGA - 93K Logic Modules

  • Operating Temperature:

    0°C ~ 100°C

  • Package / Case:

    325-LFBGA

  • Supplier Device Package:

    325-LFBGA (11x14.5)

Stock:

9

1

Part Number:

TDA2EGAHQABCRQ1

Manufacturer:

Texas Instruments

Description:

SOC PROCESSORS WITH GRAPHICS AND

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    750MHz, 800MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    760-BFBGA, FCBGA

  • Supplier Device Package:

    760-FCBGA (23x23)

Stock:

0

1

Part Number:

AGFB023R31C2I1VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 3184BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

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