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SoC (System On Chip) (4856)

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Part Number:

AGFD023R31C2I2V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 3184FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

Part Number:

AGFC019R31C2I1V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 3184FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

Part Number:

AGFC019R31C2I3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 3184FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

Part Number:

AGFC019R31C2I2V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 3184FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

Part Number:

AGFC019R31C2I3V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 3184FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    3184-BFBGA Exposed Pad

  • Supplier Device Package:

    3184-BGA (56x45)

Stock:

0

1

Part Number:

DRA829VMTGBALF

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    DSP, MCU, MPU

  • Core Processor:

    ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

  • Flash Size:

    -

  • RAM Size:

    1.5MB

  • Peripherals:

    DMA, PWM, WDT

  • Connectivity:

    I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    2GHz, 1GHz, 1.35GHz, 1GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 105°C (TJ)

  • Package / Case:

    827-BFBGA, FCBGA

  • Supplier Device Package:

    827-FCBGA (24x24)

Stock:

0

1

Part Number:

TDA4VM88TGBALFR

Manufacturer:

Texas Instruments

Description:

NEXT GENERATION SOC FAMILY FOR L

  • Series:

    -

  • Architecture:

    DSP, MCU, MPU

  • Core Processor:

    ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

  • Flash Size:

    -

  • RAM Size:

    1.5MB

  • Peripherals:

    DMA, PWM, WDT

  • Connectivity:

    MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB

  • Speed:

    2GHz, 1GHz, 1.35GHz, 1GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 105°C (TJ)

  • Package / Case:

    827-BFBGA, FCBGA

  • Supplier Device Package:

    827-FCBGA (24x24)

Stock:

1485

1

Part Number:

TDA2HVBDQAAS1RQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

TDA2HFBTQABCQ1

Manufacturer:

Texas Instruments

Description:

SOC PROCESSOR W/ FULL-FEATURED V

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    Dual ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    2.5MB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB

  • Speed:

    1.176GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    760-BFBGA, FCBGA

  • Supplier Device Package:

    760-FCBGA (23x23)

Stock:

0

1

Part Number:

AGFA019R24C2E2VB

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

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