Logo

SoC (System On Chip) (4856)

Records 0
Reset All
Records 4856
Page 427/486

Part Number:

TDA2HVBDQABCRQ1

Manufacturer:

Texas Instruments

Description:

SOC PROCESSOR W/ VIDEO & VISION

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    2.5MB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB

  • Speed:

    500MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    760-BFBGA, FCBGA

  • Supplier Device Package:

    760-FCBGA (23x23)

Stock:

0

1

Part Number:

5ASXBB3D6F40C6G

Manufacturer:

Intel

Description:

IC SOC CORTEX-A9 700MHZ 1517FBGA

  • Series:

    Arria V SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    64KB

  • Peripherals:

    DMA, POR, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    700MHz

  • Primary Attributes:

    FPGA - 350K Logic Elements

  • Operating Temperature:

    0°C ~ 85°C (TJ)

  • Package / Case:

    1517-BBGA, FCBGA

  • Supplier Device Package:

    1517-FBGA, FC (40x40)

Stock:

0

1

Part Number:

1SX065HH2F35E1VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX10SX 1152FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 650K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1152-BBGA, FCBGA

  • Supplier Device Package:

    1152-FBGA (35x35)

Stock:

0

1

Part Number:

1SX065HH2F35E2VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX10SX 1152FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 650K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1152-BBGA, FCBGA

  • Supplier Device Package:

    1152-FBGA (35x35)

Stock:

0

1

Part Number:

1SX065HH2F35E2LG

Manufacturer:

Intel

Description:

IC FPGA STRATIX10SX 1152FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 650K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    1152-BBGA, FCBGA

  • Supplier Device Package:

    1152-FBGA (35x35)

Stock:

0

1

Part Number:

MIMXRT1172CVM8AR

Manufacturer:

NXP

Description:

IC

  • Series:

    RT1170

  • Architecture:

    MPU

  • Core Processor:

    ARM Cortex-M7

  • Flash Size:

    -

  • RAM Size:

    2MB

  • Peripherals:

    Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 105°C (TJ)

  • Package / Case:

    289-LFBGA

  • Supplier Device Package:

    289-LFBGA (14x14)

Stock:

0

1

Part Number:

MPFS250T-FCVG784T2

Manufacturer:

Microchip Technology

Description:

IC SOC RISC-V 784FCBGA

  • Series:

    PolarFire®

  • Architecture:

    MPU, FPGA

  • Core Processor:

    RISC-V

  • Flash Size:

    128KB

  • RAM Size:

    2.2MB

  • Peripherals:

    DMA, PCI, PWM

  • Connectivity:

    CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

  • Speed:

    -

  • Primary Attributes:

    FPGA - 254K Logic Modules

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    784-BFBGA, FCBGA

  • Supplier Device Package:

    784-FCBGA (23x23)

Stock:

0

1

Part Number:

BCM3382DKFEBG

Manufacturer:

Broadcom

Description:

DOCSIS 3.0 DATA MODEM

  • Series:

    -

  • Architecture:

    -

  • Core Processor:

    -

  • Flash Size:

    -

  • RAM Size:

    -

  • Peripherals:

    -

  • Connectivity:

    -

  • Speed:

    -

  • Primary Attributes:

    -

  • Operating Temperature:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

1SX165HU3F50E2VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2397FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 1650K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2397-BBGA, FCBGA

  • Supplier Device Package:

    2397-FBGA, FC (50x50)

Stock:

0

1

Part Number:

1SX165HU3F50E3VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2397FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 1650K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2397-BBGA, FCBGA

  • Supplier Device Package:

    2397-FBGA, FC (50x50)

Stock:

0

1

获取最新资讯

每日获取来自全球众多供应商的最新优惠资讯