Part Number:
AGIB041R29B1E2VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-I 2957BGA
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 4M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2957-BFBGA Exposed Pad
Supplier Device Package:
2957-BGA (56x45)
Stock:
0
Part Number:
1SX165HU2F50E2VG
Manufacturer:
Intel
Description:
IC FPGA STRATIX 10 2397FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 1650K Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50x50)
Stock:
0
Part Number:
M2S150T-1FCV484M
Manufacturer:
Microchip Technology
Description:
FPGA 484-BGA
Series:
SmartFusion®2
Architecture:
MCU, FPGA
Core Processor:
ARM® Cortex®-M3
Flash Size:
512KB
RAM Size:
64KB
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed:
166MHz
Primary Attributes:
FPGA - 150K Logic Modules
Operating Temperature:
-55°C ~ 125°C (TJ)
Package / Case:
484-BFBGA
Supplier Device Package:
484-FBGA (19x19)
Stock:
0
Part Number:
1SX280LU3F50I2LGAS
Manufacturer:
Intel
Description:
IC FPGA STRATIX 10 2397FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 2800K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2397-BBGA, FCBGA
Supplier Device Package:
2397-FBGA, FC (50x50)
Stock:
0
Part Number:
MPFS095TLS-FCVG784I
Manufacturer:
Microchip Technology
Description:
IC SOC RISC-V 784BGA
Series:
PolarFire®
Architecture:
MPU, FPGA
Core Processor:
RISC-V
Flash Size:
128kB
RAM Size:
857.6kB
Peripherals:
DMA, PCI, PWM
Connectivity:
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed:
-
Primary Attributes:
FPGA - 93K Logic Modules
Operating Temperature:
-40°C ~ 100°C
Package / Case:
784-BGA
Supplier Device Package:
784-BGA
Stock:
9
Part Number:
AGIB022R31B2E2VAA
Manufacturer:
Intel
Description:
IC FPGA AGILEX-I 3184FBGA
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.2M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
MIMX9352DVVXMAB
Manufacturer:
NXP
Description:
IC
Series:
-
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
AGIB027R29A1I1V
Manufacturer:
Intel
Description:
IC
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.7M Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2957-BFBGA Exposed Pad
Supplier Device Package:
2957-BGA (56x45)
Stock:
0
Part Number:
AGIB027R29A1I2V
Manufacturer:
Intel
Description:
IC
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.7M Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
2957-BFBGA Exposed Pad
Supplier Device Package:
2957-BGA (56x45)
Stock:
0
Part Number:
AGIB027R31A3I3V
Manufacturer:
Intel
Description:
IC FPGA AGILEX-I 3184BGA
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.7M Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
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