SoC (System On Chip) (4856)

Series:

PolarFire®

Architecture:

MPU, FPGA

Core Processor:

RISC-V

Flash Size:

128kB

RAM Size:

857.6kB

Peripherals:

DMA, PCI, PWM

Connectivity:

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

Speed:

-

Primary Attributes:

FPGA - 93K Logic Modules

Operating Temperature:

-40°C ~ 100°C

Package / Case:

536-BGA

Supplier Device Package:

536-LFBGA

Series:

-

Architecture:

MCU, MPU

Core Processor:

ARM® Cortex®-A72, ARM® Cortex®-R5F

Flash Size:

-

RAM Size:

1.5MB

Peripherals:

DMA, PWM, WDT

Connectivity:

Ethernet, I2C, I3C, MCAN, MMC/SD/SDIO, SPI, UART, USB

Speed:

2GHz, 1GHz

Primary Attributes:

-

Operating Temperature:

-40°C ~ 125°C (TJ)

Package / Case:

433-BFBGA, FCBGA

Supplier Device Package:

433-FCBGA (17.2x17.2)

Series:

-

Architecture:

-

Core Processor:

-

Flash Size:

-

RAM Size:

-

Peripherals:

-

Connectivity:

-

Speed:

-

Primary Attributes:

-

Operating Temperature:

-

Package / Case:

-

Supplier Device Package:

-

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.7M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

3184-BFBGA Exposed Pad

Supplier Device Package:

3184-BGA (56x45)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.7M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

2957-BFBGA Exposed Pad

Supplier Device Package:

2957-BGA (56x45)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.7M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

3184-BFBGA Exposed Pad

Supplier Device Package:

3184-BGA (56x45)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.7M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

3184-BFBGA Exposed Pad

Supplier Device Package:

3184-BGA (56x45)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.7M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

2957-BFBGA Exposed Pad

Supplier Device Package:

2957-BGA (56x45)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.7M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

2957-BFBGA Exposed Pad

Supplier Device Package:

2957-BGA (56x45)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.2M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

3184-BFBGA Exposed Pad

Supplier Device Package:

3184-BGA (56x45)