SoC (System On Chip) (4856)

Series:

Stratix® 10 SX

Architecture:

MCU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.5GHz

Primary Attributes:

FPGA - 650K Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

1152-BBGA, FCBGA

Supplier Device Package:

1152-FBGA (35x35)

Series:

PolarFire®

Architecture:

MPU, FPGA

Core Processor:

RISC-V

Flash Size:

128kB

RAM Size:

2.2MB

Peripherals:

DMA, PCI, PWM

Connectivity:

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

Speed:

-

Primary Attributes:

FPGA - 254K Logic Modules

Operating Temperature:

-40°C ~ 100°C

Package / Case:

536-LFBGA, CSPBGA

Supplier Device Package:

536-LFBGA

Series:

Stratix® 10 SX

Architecture:

MCU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.5GHz

Primary Attributes:

FPGA - 1650K Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

2397-BBGA, FCBGA

Supplier Device Package:

2397-FBGA, FC (50x50)

Series:

-

Architecture:

-

Core Processor:

-

Flash Size:

-

RAM Size:

-

Peripherals:

-

Connectivity:

-

Speed:

-

Primary Attributes:

-

Operating Temperature:

-

Package / Case:

-

Supplier Device Package:

-

Series:

-

Architecture:

-

Core Processor:

-

Flash Size:

-

RAM Size:

-

Peripherals:

-

Connectivity:

-

Speed:

-

Primary Attributes:

-

Operating Temperature:

-

Package / Case:

-

Supplier Device Package:

-

Series:

-

Architecture:

DSP, MPU

Core Processor:

ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x

Flash Size:

-

RAM Size:

512kB

Peripherals:

DMA, POR, PWM, WDT

Connectivity:

CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

Speed:

750MHz, 800MHz

Primary Attributes:

-

Operating Temperature:

-40°C ~ 125°C (TJ)

Package / Case:

538-LFBGA, FCBGA

Supplier Device Package:

538-FCBGA (17x17)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.3M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

3184-BFBGA Exposed Pad

Supplier Device Package:

3184-BGA (56x45)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.3M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

3184-BFBGA Exposed Pad

Supplier Device Package:

3184-BGA (56x45)

Series:

-

Architecture:

DSP, MPU

Core Processor:

ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x

Flash Size:

-

RAM Size:

2.5MB

Peripherals:

DMA, POR, PWM, WDT

Connectivity:

CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB

Speed:

750MHz

Primary Attributes:

-

Operating Temperature:

-40°C ~ 125°C (TJ)

Package / Case:

760-BFBGA, FCBGA

Supplier Device Package:

760-FCBGA (23x23)

Series:

Apollo4 Blue Lite

Architecture:

MCU

Core Processor:

ARM® Cortex®-M4F

Flash Size:

2MB

RAM Size:

1.375MB

Peripherals:

AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

Connectivity:

GPIO, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART

Speed:

192MHz

Primary Attributes:

-

Operating Temperature:

-20°C ~ 60°C

Package / Case:

131-VFBGA

Supplier Device Package:

131-BGA (4.7x4.7)