SoC (System On Chip) (4856)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.2M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

3184-BFBGA Exposed Pad

Supplier Device Package:

3184-BGA (56x45)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.2M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

3184-BFBGA Exposed Pad

Supplier Device Package:

3184-BGA (56x45)

Series:

-

Architecture:

DSP, MPU

Core Processor:

Dual ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x

Flash Size:

-

RAM Size:

2.5MB

Peripherals:

DMA, POR, PWM, WDT

Connectivity:

CANbus, Ethernet, MMC/SD/SDIO, McASP, I2C, SPI, UART, USB

Speed:

650MHz

Primary Attributes:

-

Operating Temperature:

-40°C ~ 125°C (TJ)

Package / Case:

760-BFBGA, FCBGA

Supplier Device Package:

760-FCBGA (23x23)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 4M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

2957-BFBGA Exposed Pad

Supplier Device Package:

2957-BGA (56x45)

Series:

i.MX8MM

Architecture:

MPU

Core Processor:

ARM® Cortex®-A53, ARM® Cortex®-M4

Flash Size:

-

RAM Size:

288KB

Peripherals:

DMA, PWM, WDT

Connectivity:

AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART

Speed:

1.8GHz, 400MHz

Primary Attributes:

-

Operating Temperature:

0°C ~ 95°C (TJ)

Package / Case:

486-LFBGA, FCBGA

Supplier Device Package:

486-LFBGA (14x14)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.3M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

1805-BBGA Exposed Pad

Supplier Device Package:

1805-BGA (42.5x42.5)

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.3M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

1805-BBGA Exposed Pad

Supplier Device Package:

1805-BGA (42.5x42.5)

Series:

Stratix® 10 SX

Architecture:

MCU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.5GHz

Primary Attributes:

FPGA - 2800K Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

2912-BBGA, FCBGA

Supplier Device Package:

2912-FBGA, FC (55x55)

Series:

Stratix® 10 SX

Architecture:

MCU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.5GHz

Primary Attributes:

FPGA - 2800K Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

2912-BBGA, FCBGA

Supplier Device Package:

2912-FBGA, FC (55x55)

Series:

Arria V SX

Architecture:

MCU, FPGA

Core Processor:

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

64KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

800MHz

Primary Attributes:

FPGA - 350K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

1152-BBGA, FCBGA

Supplier Device Package:

1152-FBGA, FC (35x35)