Part Number:
AGIB041R31B2E2VB
Manufacturer:
Intel
Description:
IC
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 4M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
Part Number:
AGFB012R24B3E4X
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 2486FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 1.2M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
AGFB012R24B3E3E
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 2486FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 1.2M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
M2S025T-FCSG158I
Manufacturer:
Microchip Technology
Description:
M2S025T-FCSG158I
Series:
-
Architecture:
MCU, FPGA
Core Processor:
ARM® Cortex®-M3
Flash Size:
256KB
RAM Size:
64KB
Peripherals:
DDR, PCIe, SERDES
Connectivity:
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Speed:
166MHz
Primary Attributes:
FPGA - 25K Logic Modules
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
158-BGA, FCBGA
Supplier Device Package:
158-FCBGA
Stock:
1551
Part Number:
AGFB008R16A2I2VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 1546BGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 764K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1546-BFBGA Exposed Pad
Supplier Device Package:
1546-BGA (37.5x34)
Stock:
0
Part Number:
AGFB012R24B3I3E
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 2486FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 1.2M Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
AGFB008R16A2I1VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 1546BGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 764K Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
1546-BFBGA Exposed Pad
Supplier Device Package:
1546-BGA (37.5x34)
Stock:
0
Part Number:
MPFS095TLS-FCVG484I
Manufacturer:
Microchip Technology
Description:
IC SOC RISC-V 484FCBGA
Series:
PolarFire®
Architecture:
MPU, FPGA
Core Processor:
RISC-V
Flash Size:
128kB
RAM Size:
857.6kB
Peripherals:
DMA, PCI, PWM
Connectivity:
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed:
-
Primary Attributes:
FPGA - 93K Logic Modules
Operating Temperature:
-40°C ~ 100°C
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19x19)
Stock:
9
Part Number:
MPFS160T-1FCVG484T2
Manufacturer:
Microchip Technology
Description:
IC SOC RISC-V 484FCBGA
Series:
PolarFire®
Architecture:
MPU, FPGA
Core Processor:
RISC-V
Flash Size:
128KB
RAM Size:
1.4125MB
Peripherals:
DMA, PCI, PWM
Connectivity:
CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed:
-
Primary Attributes:
FPGA - 161K Logic Modules
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19x19)
Stock:
0
Part Number:
MPFS095T-FCVG484T2
Manufacturer:
Microchip Technology
Description:
IC SOC RISC-V 484FCBGA
Series:
PolarFire®
Architecture:
MPU, FPGA
Core Processor:
RISC-V
Flash Size:
128KB
RAM Size:
857.6KB
Peripherals:
DMA, PCI, PWM
Connectivity:
CANbus, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed:
-
Primary Attributes:
FPGA - 93K Logic Modules
Operating Temperature:
-40°C ~ 125°C (TJ)
Package / Case:
484-BFBGA, FCBGA
Supplier Device Package:
484-FCBGA (19x19)
Stock:
0
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