SoC (System On Chip) (4856)

Series:

-

Architecture:

DSP, MPU

Core Processor:

ARM® Cortex®-M4, C66x

Flash Size:

-

RAM Size:

512kB

Peripherals:

DMA, PWM, WDT

Connectivity:

CANbus, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

Speed:

212.8MHz, 745MHz

Primary Attributes:

-

Operating Temperature:

-40°C ~ 125°C (TJ)

Package / Case:

367-BFBGA, FCBGA

Supplier Device Package:

367-FCBGA (15x15)

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 764K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

-

Supplier Device Package:

-

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.3M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

2340-BFBGA Exposed Pad

Supplier Device Package:

2340-BGA (45x42)

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.3M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

2340-BFBGA Exposed Pad

Supplier Device Package:

2340-BGA (45x42)

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.3M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

2340-BFBGA Exposed Pad

Supplier Device Package:

2340-BGA (45x42)

Series:

-

Architecture:

DSP, MPU

Core Processor:

ARM® Cortex®-M4, C66x

Flash Size:

-

RAM Size:

512kB

Peripherals:

DMA, POR, PWM, WDT

Connectivity:

CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

Speed:

212.8MHz, 745MHz

Primary Attributes:

-

Operating Temperature:

-40°C ~ 125°C (TJ)

Package / Case:

367-BFBGA, FCBGA

Supplier Device Package:

367-FCBGA (15x15)

Series:

SmartFusion®2

Architecture:

MCU, FPGA

Core Processor:

ARM® Cortex®-M3

Flash Size:

128KB

RAM Size:

64KB

Peripherals:

DDR, PCIe, SERDES

Connectivity:

CANbus, Ethernet, I2C, SPI, UART/USART, USB

Speed:

166MHz

Primary Attributes:

FPGA - 5K Logic Modules

Operating Temperature:

-

Package / Case:

Die

Supplier Device Package:

Die

Series:

Arria V SX

Architecture:

MCU, FPGA

Core Processor:

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

64KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

800MHz

Primary Attributes:

FPGA - 462K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

1517-BBGA, FCBGA

Supplier Device Package:

1517-FBGA, FC (40x40)

Series:

-

Architecture:

-

Core Processor:

-

Flash Size:

-

RAM Size:

-

Peripherals:

-

Connectivity:

-

Speed:

-

Primary Attributes:

-

Operating Temperature:

-

Package / Case:

-

Supplier Device Package:

-

Series:

-

Architecture:

-

Core Processor:

-

Flash Size:

-

RAM Size:

-

Peripherals:

-

Connectivity:

-

Speed:

-

Primary Attributes:

-

Operating Temperature:

-

Package / Case:

-

Supplier Device Package:

-