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SoC (System On Chip) (4856)

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Part Number:

AGFB008R24C3E4X

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340FBGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 764K Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

AGFD023R24C3I3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 2.3M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGFC019R24C3I3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGFC019R24C3E4X

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

1SX280HH2F55I1VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2912FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 2800K Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2912-BBGA, FCBGA

  • Supplier Device Package:

    2912-FBGA, FC (55x55)

Stock:

0

1

Part Number:

AGFC019R24C3E3V

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

AGFC019R24C3E3E

Manufacturer:

Intel

Description:

IC FPGA AGILEX-F 2340BGA

  • Series:

    Agilex F

  • Architecture:

    MPU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.4GHz

  • Primary Attributes:

    FPGA - 1.9M Logic Elements

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    2340-BFBGA Exposed Pad

  • Supplier Device Package:

    2340-BGA (45x42)

Stock:

0

1

Part Number:

1SX280HH2F55I2LG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2912FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 2800K Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2912-BBGA, FCBGA

  • Supplier Device Package:

    2912-FBGA, FC (55x55)

Stock:

0

1

Part Number:

TDA2SXBTQABCQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Architecture:

    DSP, MPU

  • Core Processor:

    ARM® Cortex®-A15, Dual ARM® Cortex®-M4, C66x

  • Flash Size:

    -

  • RAM Size:

    2.5MB

  • Peripherals:

    DMA, POR, PWM, WDT

  • Connectivity:

    CANbus, Ethernet, I2C, McASP, MMC/SD/SDIO, SPI, UART, USB

  • Speed:

    750MHz, 1.18GHz

  • Primary Attributes:

    -

  • Operating Temperature:

    -40°C ~ 125°C (TJ)

  • Package / Case:

    760-BFBGA, FCBGA

  • Supplier Device Package:

    760-FCBGA (23x23)

Stock:

0

1

Part Number:

1SX280HH2F55I2VG

Manufacturer:

Intel

Description:

IC FPGA STRATIX 10 2912FBGA

  • Series:

    Stratix® 10 SX

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA, WDT

  • Connectivity:

    EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1.5GHz

  • Primary Attributes:

    FPGA - 2800K Logic Elements

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    2912-BBGA, FCBGA

  • Supplier Device Package:

    2912-FBGA, FC (55x55)

Stock:

0

1

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