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Embedded Processors & Controllers (139284)

Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.

Records 139284
Page 13886/13929
XC7Z030-3FBG676E

Part Number:

XC7Z030-3FBG676E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 1GHZ 676FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1GHz

  • Primary Attributes:

    Kintex™-7 FPGA, 125K Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    676-BBGA, FCBGA

  • Supplier Device Package:

    676-FCBGA (27x27)

Stock:

172

1
XC7Z030-3FFG676E

Part Number:

XC7Z030-3FFG676E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 1GHZ 676FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1GHz

  • Primary Attributes:

    Kintex™-7 FPGA, 125K Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    676-BBGA, FCBGA

  • Supplier Device Package:

    676-FCBGA (27x27)

Stock:

355

1
XC7Z030-3SBG485E

Part Number:

XC7Z030-3SBG485E

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 1GHZ 485FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    1GHz

  • Primary Attributes:

    Kintex™-7 FPGA, 125K Logic Cells

  • Operating Temperature:

    0°C ~ 100°C (TJ)

  • Package / Case:

    484-FBGA, FCBGA

  • Supplier Device Package:

    485-FCBGA (19x19)

Stock:

450

1
XC7Z030-L2FBG484I

Part Number:

XC7Z030-L2FBG484I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 484FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 125K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    484-BBGA, FCBGA

  • Supplier Device Package:

    484-FCBGA (23x23)

Stock:

364

1
XC7Z030-L2FBG676I

Part Number:

XC7Z030-L2FBG676I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 125K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    676-BBGA, FCBGA

  • Supplier Device Package:

    676-FCBGA (27x27)

Stock:

400

1
XC7Z030-L2FFG676I

Part Number:

XC7Z030-L2FFG676I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 676FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 125K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    676-BBGA, FCBGA

  • Supplier Device Package:

    676-FCBGA (27x27)

Stock:

293

1
XC7Z030-L2SBG485I

Part Number:

XC7Z030-L2SBG485I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 800MHZ 485FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    800MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 125K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    484-FBGA, FCBGA

  • Supplier Device Package:

    485-FCBGA (19x19)

Stock:

258

1
XC7Z035-1FBG676C

Part Number:

XC7Z035-1FBG676C

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 667MHZ 676FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    667MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 275K Logic Cells

  • Operating Temperature:

    0°C ~ 85°C (TJ)

  • Package / Case:

    676-BBGA, FCBGA

  • Supplier Device Package:

    676-FCBGA (27x27)

Stock:

322

1
XC7Z035-1FBG676I

Part Number:

XC7Z035-1FBG676I

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 667MHZ 676FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    667MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 275K Logic Cells

  • Operating Temperature:

    -40°C ~ 100°C (TJ)

  • Package / Case:

    676-BBGA, FCBGA

  • Supplier Device Package:

    676-FCBGA (27x27)

Stock:

269

1
XC7Z035-1FFG676C

Part Number:

XC7Z035-1FFG676C

Manufacturer:

Xilinx

Description:

IC SOC CORTEX-A9 667MHZ 676FCBGA

  • Series:

    Zynq®-7000

  • Architecture:

    MCU, FPGA

  • Core Processor:

    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

  • Flash Size:

    -

  • RAM Size:

    256KB

  • Peripherals:

    DMA

  • Connectivity:

    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

  • Speed:

    667MHz

  • Primary Attributes:

    Kintex™-7 FPGA, 275K Logic Cells

  • Operating Temperature:

    0°C ~ 85°C (TJ)

  • Package / Case:

    676-BBGA, FCBGA

  • Supplier Device Package:

    676-FCBGA (27x27)

Stock:

397

1

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