Embedded Processors & Controllers are the intelligent computing cores at the heart of modern electronic systems, designed to execute dedicated functions within a larger product. They combine processing capability, memory, and integrated peripherals on a single chip for efficient and reliable real-time operation.
Part Number:
XC7Z030-1FBG676C
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
432
Part Number:
XC7Z030-1FBG676I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
468
Part Number:
XC7Z030-1FF676I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
464
Part Number:
XC7Z030-1FFG676C
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
209
Part Number:
XC7Z030-1FFG676I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 676FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
676-BBGA, FCBGA
Supplier Device Package:
676-FCBGA (27x27)
Stock:
259
Part Number:
XC7Z030-1SB485I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 485FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA, FCBGA
Supplier Device Package:
485-FCBGA (19x19)
Stock:
138
Part Number:
XC7Z030-1SBG485C
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 485FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
484-FBGA, FCBGA
Supplier Device Package:
485-FCBGA (19x19)
Stock:
352
Part Number:
XC7Z030-1SBG485I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 667MHZ 485FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
667MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-FBGA, FCBGA
Supplier Device Package:
485-FCBGA (19x19)
Stock:
343
Part Number:
XC7Z030-2FB484I
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 484FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FCBGA (23x23)
Stock:
128
Part Number:
XC7Z030-2FBG484E
Manufacturer:
Xilinx
Description:
IC SOC CORTEX-A9 800MHZ 484FCBGA
Series:
Zynq®-7000
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA
Connectivity:
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
484-BBGA, FCBGA
Supplier Device Package:
484-FCBGA (23x23)
Stock:
295
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