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Sockets for ICs, Transistors (11554)

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Records 11554
Page 1100/1156

Part Number:

SIP1X15-011BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 15POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    15 (1 x 15)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5832

1

Part Number:

SIP1X15-014BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 15POS TIN

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    150µin (3.81µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    15 (1 x 15)

  • Contact Material - Post:

    Tin

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8640

1

Part Number:

SIP1X16-011BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 16POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    16 (1 x 16)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

2556

1

Part Number:

SIP1X16-014BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 16POS TIN

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    150µin (3.81µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    16 (1 x 16)

  • Contact Material - Post:

    Tin

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7848

1

Part Number:

SIP1X16-041BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 16POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    16 (1 x 16)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6462

1

Part Number:

SIP1X17-001BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 17POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    17 (1 x 17)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

4788

1

Part Number:

SIP1X20-001BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 20POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    20 (1 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

5454

1

Part Number:

SIP1X20-011BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 20POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    20 (1 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

3294

1

Part Number:

SIP1X20-041BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 20POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    20 (1 x 20)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7974

1

Part Number:

SIP1X21-011BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 21POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    21 (1 x 21)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6714

1

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