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Sockets for ICs, Transistors (11554)

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Records 11554
Page 1099/1156

Part Number:

SIP1X09-001BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 9POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    9 (1 x 9)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

3816

1

Part Number:

SIP1X10-001BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 10POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    10 (1 x 10)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

2052

1

Part Number:

SIP1X10-011BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 10POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    10 (1 x 10)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

7218

1

Part Number:

SIP1X10-041BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 10POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    10 (1 x 10)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8856

1

Part Number:

SIP1X11-011BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 11POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    11 (1 x 11)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

4626

1

Part Number:

SIP1X12-011BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 12POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    12 (1 x 12)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

2100

1

Part Number:

SIP1X12-014BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 12POS TIN

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    150µin (3.81µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    12 (1 x 12)

  • Contact Material - Post:

    Tin

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6390

1

Part Number:

SIP1X13-011BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 13POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    13 (1 x 13)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8514

1

Part Number:

SIP1X14-011BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 14POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    10µin (0.25µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    14 (1 x 14)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

8208

1

Part Number:

SIP1X14-041BLF

Manufacturer:

Amphenol FCI

Description:

CONN SOCKET SIP 14POS GOLD

  • Series:

    Brass

  • Type:

    -

  • Number of Positions or Pins (Grid):

    Solder

  • Pitch - Mating:

    Tin

  • Contact Finish - Mating:

    Amphenol FCI

  • Contact Finish Thickness - Mating:

    SIP

  • Contact Material - Mating:

    0.100" (2.54mm)

  • Mounting Type:

    Closed Frame

  • Features:

    30µin (0.76µm)

  • Termination:

    Polyphenylene Sulfide (PPS), Glass Filled

  • Pitch - Post:

    200µin (5.08µm)

  • Contact Finish - Post:

    SIP1x

  • Contact Finish Thickness - Post:

    14 (1 x 14)

  • Contact Material - Post:

    Gold

  • Housing Material:

    Beryllium Copper

  • Operating Temperature:

    0.100" (2.54mm)

Stock:

6462

1

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