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60V, 100V|1.7A, 500mA|-
OriginalGlobal SourcingFast DeliveryQuality CertifiedTechnical SupportBulk Discount
TRANS GAN 3N-CH BUMPED DIE
Specifications
- Brand
- EPC
- Package
- 9-VFBGA
- Packaging
- —
- Weight
- —
Total Inventory
23,700pcs
Ship within 8 hours
MOQ: 1 pcs
Certifications & Authorizations
Product Video
Discover how EPC2108ENGRT from EPC fits into your design. Our component experts walk through key specifications, quality certifications, and typical application scenarios.
- Authentic sourcing with full traceability
- Rigorous incoming quality inspection
- Competitive pricing & global fast delivery
- Dedicated application engineering support
Technical Specifications
| Manufacturer | EPC | |
| Series | eGaN? | |
| FET Type | 3 N-Channel (Half Bridge + Synchronous Bootstrap) | |
| FET Feature | GaNFET (Gallium Nitride) | |
| Drain to Source Voltage (Vdss) | 60V, 100V | |
| Current - Continuous Drain (Id) @ 25°C | 1.7A, 500mA | |
| Rds On (Max) @ Id, Vgs | 190 mOhm @ 2.5A, 5V, 3.3 Ohm @ 2.5A, 5V | |
| Vgs(th) (Max) @ Id | 2.5V @ 100µA, 2.5V @ 20µA | |
| Gate Charge (Qg) (Max) @ Vgs | 0.22nC @ 5V, 0.044nC @ 5V | |
| Input Capacitance (Ciss) (Max) @ Vds | 22pF @ 30V, 7pF @ 30V | |
| Power - Max | - | |
| Operating Temperature | -40°C ~ 150°C (TJ) | |
| Mounting Type | Surface Mount | |
| Package / Case | 9-VFBGA | |
| Supplier Device Package | 9-BGA (1.35x1.35) |
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