Part Number:
SL2S1502FUD,003
Manufacturer:
NXP
Description:
IC I-CODE ILT UNCASED WAFER
Series:
-
Type:
Die
Frequency:
NXP
Standards:
1.5 V ~ 1.7 V
Interface:
I-Code
Voltage - Supply:
Wafer
Operating Temperature:
13.56MHz
Package / Case:
ISO 15693, ISO 18000-3
Supplier Device Package:
-40°C ~ 85°C
Stock:
3888
Part Number:
SL2S1402FUD,003
Manufacturer:
NXP
Description:
IC I-CODE ILT UNCASED WAFER
Series:
-
Type:
Die
Frequency:
NXP
Standards:
1.5 V ~ 1.7 V
Interface:
I-Code
Voltage - Supply:
Wafer
Operating Temperature:
13.56MHz
Package / Case:
ISO 15693, ISO 18000-3
Supplier Device Package:
-40°C ~ 85°C
Stock:
3294
Part Number:
ST25TB512-AT6G6
Manufacturer:
STMicroelectronics
Description:
IC MEM TAG/RFID 13.56MHZ DIE
Series:
-
Type:
-
Frequency:
STMicroelectronics
Standards:
-
Interface:
-
Voltage - Supply:
-
Operating Temperature:
13.56MHz
Package / Case:
ISO 14443
Supplier Device Package:
-40°C ~ 85°C
Stock:
3546
Part Number:
ST25TB512-AC6G6
Manufacturer:
STMicroelectronics
Description:
IC MEM TAG/RFID 13.56MHZ DIE
Series:
-
Type:
-
Frequency:
STMicroelectronics
Standards:
-
Interface:
-
Voltage - Supply:
-
Operating Temperature:
13.56MHz
Package / Case:
ISO 14443
Supplier Device Package:
-40°C ~ 85°C
Stock:
8604
Part Number:
HTCICC6403FUG/AM,0
Manufacturer:
NXP
Description:
TRANSPONDER RFIC HITAG RO64 DIE
Series:
-
Type:
Die
Frequency:
NXP
Standards:
5V
Interface:
HITAG?
Voltage - Supply:
Die
Operating Temperature:
100kHz ~ 150kHz
Package / Case:
-
Supplier Device Package:
-40°C ~ 85°C
Stock:
6498
Part Number:
NT2L1011G0DUFV
Manufacturer:
NXP
Description:
IC SMART TAG NFC TYPE2 UNCASED
Series:
-
Type:
Die
Frequency:
NXP
Standards:
-
Interface:
-
Voltage - Supply:
Wafer
Operating Temperature:
13.56MHz
Package / Case:
ISO 14443
Supplier Device Package:
-25°C ~ 70°C
Stock:
7902
Part Number:
NT2L1011G0DUDV
Manufacturer:
NXP
Description:
IC SMART TAG NFC TYPE2 UNCASED
Series:
-
Type:
Die
Frequency:
NXP
Standards:
-
Interface:
-
Voltage - Supply:
Wafer
Operating Temperature:
13.56MHz
Package / Case:
ISO 14443
Supplier Device Package:
-25°C ~ 70°C
Stock:
3132
Part Number:
SL3S1213FUD/BG,003
Manufacturer:
NXP
Description:
IC U-CODE G2IL+ DIE WAFER
Series:
-
Type:
Die
Frequency:
NXP
Standards:
1.8V
Interface:
U-Code
Voltage - Supply:
Wafer
Operating Temperature:
840MHz ~ 960MHz
Package / Case:
EPC
Supplier Device Package:
-40°C ~ 85°C
Stock:
7308
Part Number:
SL3S1213FUF,003
Manufacturer:
NXP
Description:
IC UCODE G2XL UNCASED FOIL
Series:
-
Type:
Die
Frequency:
NXP
Standards:
1.8V
Interface:
U-Code
Voltage - Supply:
Die
Operating Temperature:
840MHz ~ 960MHz
Package / Case:
EPC
Supplier Device Package:
-40°C ~ 85°C
Stock:
2556
Part Number:
SL3ICS1202FUG/V7AF
Manufacturer:
NXP
Description:
IC U-CODE G2XL UNCASED WAFER
Series:
-
Type:
Die
Frequency:
NXP
Standards:
-
Interface:
U-Code
Voltage - Supply:
Die
Operating Temperature:
840MHz ~ 960MHz
Package / Case:
ISO 15693, ISO 18000-6
Supplier Device Package:
-40°C ~ 85°C
Stock:
3726
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