Logo

Power Management - Specialized (6740)

Records 0
Reset All
Records 6740
Page 618/674

Part Number:

TPS6591106A2ZRCR-P

Manufacturer:

Texas Instruments

Description:

IC REGULATOR CONV SMD

  • Series:

    -

  • Applications:

    -

  • Current - Supply:

    -

  • Voltage - Supply:

    -

  • Operating Temperature:

    -

  • Mounting Type:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

O9039A35CIZWSRQ1

Manufacturer:

Texas Instruments

Description:

PROTOTYPE

  • Series:

    -

  • Applications:

    -

  • Current - Supply:

    -

  • Voltage - Supply:

    -

  • Operating Temperature:

    -

  • Mounting Type:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

MPF5023CMMA0ES

Manufacturer:

NXP

Description:

POWER MANAGEMENT IC, PRE-PROG, 3

  • Series:

    -

  • Applications:

    High Performance i.MX 8, S32x Processor Based

  • Current - Supply:

    200µA

  • Voltage - Supply:

    2.5V ~ 5.5V

  • Operating Temperature:

    -40°C ~ 125°C (TA)

  • Mounting Type:

    Surface Mount, Wettable Flank

  • Package / Case:

    40-VFQFN Exposed Pad

  • Supplier Device Package:

    40-HVQFN (6x6)

Stock:

0

1

Part Number:

AP4341NTR-BG1

Manufacturer:

Diodes Incorporated

Description:

IC VREF SHUNT

  • Series:

    -

  • Applications:

    -

  • Current - Supply:

    -

  • Voltage - Supply:

    -

  • Operating Temperature:

    -

  • Mounting Type:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

MC34PF8100F3EPR2

Manufacturer:

NXP

Description:

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Series:

    -

  • Applications:

    High Performance i.MX 8, S32x Processor Based

  • Current - Supply:

    -

  • Voltage - Supply:

    2.5V ~ 5.5V

  • Operating Temperature:

    -40°C ~ 105°C (TA)

  • Mounting Type:

    Surface Mount, Wettable Flank

  • Package / Case:

    56-VFQFN Exposed Pad

  • Supplier Device Package:

    56-HVQFN (8x8)

Stock:

0

1

Part Number:

MC34PF8100EREPR2

Manufacturer:

NXP

Description:

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Series:

    -

  • Applications:

    High Performance i.MX 8, S32x Processor Based

  • Current - Supply:

    -

  • Voltage - Supply:

    2.5V ~ 5.5V

  • Operating Temperature:

    -40°C ~ 105°C (TA)

  • Mounting Type:

    Surface Mount, Wettable Flank

  • Package / Case:

    56-VFQFN Exposed Pad

  • Supplier Device Package:

    56-HVQFN (8x8)

Stock:

0

1

Part Number:

MC33PF8200DHESR2

Manufacturer:

NXP

Description:

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Series:

    -

  • Applications:

    High Performance i.MX 8, S32x Processor Based

  • Current - Supply:

    -

  • Voltage - Supply:

    2.5V ~ 5.5V

  • Operating Temperature:

    -40°C ~ 105°C (TA)

  • Mounting Type:

    Surface Mount, Wettable Flank

  • Package / Case:

    56-VFQFN Exposed Pad

  • Supplier Device Package:

    56-HVQFN (8x8)

Stock:

0

1

Part Number:

BD9886FV-PE2

Manufacturer:

Rohm Semiconductor

Description:

IC POWER MANAGEMENT SMD

  • Series:

    -

  • Applications:

    -

  • Current - Supply:

    -

  • Voltage - Supply:

    -

  • Operating Temperature:

    -

  • Mounting Type:

    -

  • Package / Case:

    -

  • Supplier Device Package:

    -

Stock:

0

1

Part Number:

MVR5510AMMA4ESR2

Manufacturer:

NXP

Description:

IC PMIC VR5510

  • Series:

    -

  • Applications:

    -

  • Current - Supply:

    15mA

  • Voltage - Supply:

    2.7V ~ 60V

  • Operating Temperature:

    -40°C ~ 125°C (TA)

  • Mounting Type:

    Surface Mount, Wettable Flank

  • Package / Case:

    56-VFQFN Exposed Pad

  • Supplier Device Package:

    56-HVQFN (8x8)

Stock:

0

1

Part Number:

ADP50460008CBZR

Manufacturer:

Analog Devices

Description:

IC COMPACT PMU 64WLCSP

  • Series:

    -

  • Applications:

    Digital Camera

  • Current - Supply:

    4.75mA

  • Voltage - Supply:

    2.1V ~ 5.5V

  • Operating Temperature:

    -25°C ~ 85°C (TA)

  • Mounting Type:

    Surface Mount

  • Package / Case:

    64-UFBGA, WLCSP

  • Supplier Device Package:

    64-WLCSP (3.96x3.96)

Stock:

0

1

获取最新资讯

每日获取来自全球众多供应商的最新优惠资讯