Part Number:
AGIB023R31B2E2VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-I 3184BGA
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
Part Number:
AGIB023R31B2E1VB
Manufacturer:
Intel
Description:
IC FPGA AGILEX-I 3184BGA
Series:
Agilex I
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 2.3M Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
3184-BFBGA Exposed Pad
Supplier Device Package:
3184-BGA (56x45)
Stock:
0
Part Number:
MPFS095TS-FCVG784I
Manufacturer:
Microchip Technology
Description:
IC SOC RISC-V 784BGA
Series:
PolarFire®
Architecture:
MPU, FPGA
Core Processor:
RISC-V
Flash Size:
128kB
RAM Size:
857.6kB
Peripherals:
DMA, PCI, PWM
Connectivity:
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Speed:
-
Primary Attributes:
FPGA - 93K Logic Modules
Operating Temperature:
-40°C ~ 100°C
Package / Case:
784-BGA
Supplier Device Package:
784-BGA
Stock:
9
Part Number:
AGFD019R25A3I3E
Manufacturer:
Intel
Description:
IC FPGA AGILEX-F 2581FBGA
Series:
Agilex F
Architecture:
MPU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.4GHz
Primary Attributes:
FPGA - 1.9M Logic Elements
Operating Temperature:
-40°C ~ 100°C (TJ)
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
BCM3384DUKFSBGB0T
Manufacturer:
Broadcom
Description:
CABLE MODEM
Series:
-
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
MIMX9331AVTXMAB
Manufacturer:
NXP
Description:
IC
Series:
-
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
MIMX9312XVXXMAB
Manufacturer:
NXP
Description:
IC
Series:
-
Architecture:
-
Core Processor:
-
Flash Size:
-
RAM Size:
-
Peripherals:
-
Connectivity:
-
Speed:
-
Primary Attributes:
-
Operating Temperature:
-
Package / Case:
-
Supplier Device Package:
-
Stock:
0
Part Number:
1SX110HN2F43E2VG
Manufacturer:
Intel
Description:
IC FPGA STRATIX 10 1760FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 1100K Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FBGA (42.5x42.5)
Stock:
0
Part Number:
1SX110HN2F43E1VG
Manufacturer:
Intel
Description:
IC FPGA STRATIX 10 1760FBGA
Series:
Stratix® 10 SX
Architecture:
MCU, FPGA
Core Processor:
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
256KB
Peripherals:
DMA, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
1.5GHz
Primary Attributes:
FPGA - 1100K Logic Elements
Operating Temperature:
0°C ~ 100°C (TJ)
Package / Case:
1760-BBGA, FCBGA
Supplier Device Package:
1760-FBGA (42.5x42.5)
Stock:
0
Part Number:
5ASXFB5G4F35C5G
Manufacturer:
Intel
Description:
IC SOC CORTEX-A9 800MHZ 1152FBGA
Series:
Arria V SX
Architecture:
MCU, FPGA
Core Processor:
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size:
-
RAM Size:
64KB
Peripherals:
DMA, POR, WDT
Connectivity:
EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed:
800MHz
Primary Attributes:
FPGA - 462K Logic Elements
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
1152-BBGA, FCBGA
Supplier Device Package:
1152-FBGA, FC (35x35)
Stock:
0
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