SoC (System On Chip) (4856)

Series:

i.MX8MQ

Architecture:

MPU

Core Processor:

ARM® Cortex®-A53, ARM® Cortex®-M4

Flash Size:

-

RAM Size:

160kB

Peripherals:

DMA, PWM, WDT

Connectivity:

AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART

Speed:

1.5GHz

Primary Attributes:

-

Operating Temperature:

0°C ~ 95°C (TJ)

Package / Case:

621-FBGA, FCBGA

Supplier Device Package:

621-FCPBGA (17x17)

Series:

PolarFire®

Architecture:

MPU, FPGA

Core Processor:

RISC-V

Flash Size:

128kB

RAM Size:

1.4125MB

Peripherals:

DMA, PCI, PWM

Connectivity:

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

Speed:

-

Primary Attributes:

FPGA - 161K Logic Modules

Operating Temperature:

-40°C ~ 100°C

Package / Case:

784-BFBGA, FCBGA

Supplier Device Package:

784-FCBGA (23x23)

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 1.2M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

-

Supplier Device Package:

-

Series:

Arria V ST

Architecture:

MCU, FPGA

Core Processor:

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

64KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

800MHz

Primary Attributes:

FPGA - 350K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

1152-BBGA, FCBGA

Supplier Device Package:

1152-FBGA, FC (35x35)

Series:

Arria V ST

Architecture:

MCU, FPGA

Core Processor:

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

64KB

Peripherals:

DMA, POR, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.05GHz

Primary Attributes:

FPGA - 350K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

1152-BBGA, FCBGA

Supplier Device Package:

1152-FBGA, FC (35x35)

Series:

PolarFire®

Architecture:

MPU, FPGA

Core Processor:

RISC-V

Flash Size:

128kB

RAM Size:

857.6kB

Peripherals:

DMA, PCI, PWM

Connectivity:

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

Speed:

-

Primary Attributes:

FPGA - 93K Logic Modules

Operating Temperature:

-40°C ~ 100°C

Package / Case:

484-BFBGA, FCBGA

Supplier Device Package:

484-FCBGA (19x19)

Series:

PolarFire®

Architecture:

MPU, FPGA

Core Processor:

RISC-V

Flash Size:

128kB

RAM Size:

857.6kB

Peripherals:

DMA, PCI, PWM

Connectivity:

CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG

Speed:

-

Primary Attributes:

FPGA - 93K Logic Modules

Operating Temperature:

0°C ~ 100°C

Package / Case:

484-BFBGA, FCBGA

Supplier Device Package:

484-FCBGA (19x19)

Series:

-

Architecture:

-

Core Processor:

-

Flash Size:

-

RAM Size:

-

Peripherals:

-

Connectivity:

-

Speed:

-

Primary Attributes:

-

Operating Temperature:

-

Package / Case:

-

Supplier Device Package:

-

Series:

Agilex I

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 4M Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

3184-BFBGA Exposed Pad

Supplier Device Package:

3184-BGA (56x45)

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 2.7M Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

-

Supplier Device Package:

-