SoC (System On Chip) (4856)

Series:

-

Architecture:

DSP, MCU, MPU

Core Processor:

ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x

Flash Size:

-

RAM Size:

1.5MB

Peripherals:

DMA, PWM, WDT

Connectivity:

MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB

Speed:

2GHz, 1GHz, 1GHz

Primary Attributes:

-

Operating Temperature:

-40°C ~ 125°C (TJ)

Package / Case:

770-BFBGA, FCBGA

Supplier Device Package:

770-FCBGA (23x23)

Series:

Apollo3 Blue

Architecture:

MCU

Core Processor:

ARM® Cortex®-M4F

Flash Size:

1MB

RAM Size:

384KB

Peripherals:

Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

Connectivity:

I2C, SPI, UART/USART

Speed:

96MHz

Primary Attributes:

-

Operating Temperature:

-40°C ~ 85°C (TA)

Package / Case:

81-WFBGA

Supplier Device Package:

81-BGA (4.5x4.5)

Series:

Stratix® 10 SX

Architecture:

MCU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.5GHz

Primary Attributes:

FPGA - 1650K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

2397-BBGA, FCBGA

Supplier Device Package:

2397-FBGA, FC (50x50)

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 573K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

-

Supplier Device Package:

-

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 573K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

-

Supplier Device Package:

-

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 573K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

-

Supplier Device Package:

-

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 573K Logic Elements

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

-

Supplier Device Package:

-

Series:

-

Architecture:

-

Core Processor:

-

Flash Size:

-

RAM Size:

-

Peripherals:

-

Connectivity:

-

Speed:

-

Primary Attributes:

-

Operating Temperature:

-

Package / Case:

-

Supplier Device Package:

-

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 573K Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

-

Supplier Device Package:

-

Series:

Agilex F

Architecture:

MPU, FPGA

Core Processor:

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

Flash Size:

-

RAM Size:

256KB

Peripherals:

DMA, WDT

Connectivity:

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Speed:

1.4GHz

Primary Attributes:

FPGA - 573K Logic Elements

Operating Temperature:

0°C ~ 100°C (TJ)

Package / Case:

-

Supplier Device Package:

-